CVE-2023-33063

Qualcomm Multiple Chipsets Use-After-Free Vulnerability

Details

CISA date: 2023-12-05
Affected versions: Multiple Chipsets
Summary: Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.
Remediation: Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
Exploit info: No exploit-tagged NVD references in our cache; see the CISA KEV link below.

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Information is aggregated from multiple authoritative sources for convenience; verify with NVD and vendors before operational decisions.